Motorola  MVME162P-242SE VME处理器模块

板被插入到两个卡槽中，每侧一个，与待测板相邻，以模拟高功率密度系统配置。两台轴流风机的装配，每台风机额定功率为71 CFM，直接安装在VME卡插件箱下。

The boards were inserted into two card slots, one on each side, adjacent to the board to be tested to simulate a high power density system configuration. Two axial fans were assembled, each rated at 71 CFM, and mounted directly under the VME card insert boxes.

输入的空气温测量风扇组件和插件箱之间，在那里输入的气流第一次遇到正在测试的模块。当模块受到环境温度变化的影响时，会执行测试软件。对关键的高功率密度集成电路的外壳温度进行监控。

The input air temperature is measured between the fan assembly and the plug-in box where the input airflow first encounters the module being tested. The test software is executed when the module is subjected to a change in ambient temperature. The case temperature of critical high power density integrated circuits is monitored.

虽然冷却所需的确切气流量取决于环境空气温度以及电路板和其他热源的类型、数量和位置，但通常在模块上流过5 CFM和320 LFM的气流时可以实现充分的冷却。

While the exact amount of air flow required for cooling depends on the ambient air temperature as well as the type and location of boards and type, number and location of other heat sources, adequate cooling can usually be achieved with an airflow over the module of 5 CFM and 320 LFM of airflow over the module will typically achieve adequate cooling.