Motorola  MVME162P-244L VME处理器模块

输入的空气温测量风扇组件和插件箱之间，在那里输入的气流第一次遇到正在测试的模块。当模块受到环境温度变化的影响时，会执行测试软件。对关键的高功率密度集成电路的外壳温度进行监控。

The input air temperature is measured between the fan assembly and the plug-in box where the input airflow first encounters the module being tested. The test software is executed when the module is subjected to a change in ambient temperature. The case temperature of critical high power density integrated circuits is monitored.

虽然冷却所需的确切气流量取决于环境空气温度以及电路板和其他热源的类型、数量和位置，但通常在模块上流过5 CFM和320 LFM的气流时可以实现充分的冷却。

While the exact amount of air flow required for cooling depends on the ambient air temperature as well as the type and location of boards and type, number and location of other heat sources, adequate cooling can usually be achieved with an airflow over the module of 5 CFM and 320 LFM of airflow over the module will typically achieve adequate cooling.

在具有较低最大环境的环境中冷却模块所需的气流较少。在更有利的热条件下，有可能在高于55摄氏度的温度下可靠地操作模块，同时增加气流。值得注意的是，除了空气移动器的额定CFM外，还有几个因素决定了流过模块的空气的实际体积和速度。

Less airflow is required to cool the module in environments with lower maximum ambient conditions. Under more favourable thermal conditions, it is possible to reliably operate the module at temperatures above 55 degrees Celsius with increased airflow. It is important to note that in addition to the rated CFM of the air mover, several factors determine the actual volume and velocity of air flowing through the module.